Raising Capital for AI Semiconductor Fab, Foundry & Advanced Packaging Startups: which investors are active in the space.
AI semiconductor fab, foundry & advanced-packaging in 2026 splits across (a) leading-edge-foundry + GAA + backside-power-delivery + high-NA-EUV (TSMC $TSM Taiwan Semiconductor Manufacturing Company Hsinchu Fab-18-N3+Fab-20-N2-Baoshan 2025-risk-production+Fab-21-Arizona Phoenix N4-Q4-2024+N3-2028+N2-2030+Fab Kumamoto JASM N28+22+16+12+Sony+Denso+Toyota+Fab-2 JASM-2027+ESMC European Semiconductor Manufacturing Company Dresden N28+22+16+12+Bosch+Infineon+NXP-2024-groundbreaking-2027-production+ 3DFabric+CoWoS-S+CoWoS-L+CoWoS-R+SoIC+InFO_oS+InFO_PoP+ N3E+N3P+N3X+N2+N2P+A16-Super Power Rail 2026-2028+N1.6+A14-2028+ 3nm-Apple M3+M4+A17+A18+M4 Pro+Max+Ultra+ 5nm-A15+A16+M1+M2+H100+B100+B200+GB200+MI300+MI325+ Grace+Grace-Hopper+GH200+Cerebras WSE-3+ Google TPU v5p+v6+v7+ AWS Graviton3+4+Trainium2+3+Inferentia2+ Meta MTIA+ Microsoft Maia+ OpenAI-Broadcom-2026+ Anthropic-AWS Trainium+ MediaTek+ Broadcom+ Marvell+ Qualcomm+ AMD+ Nvidia+ Apple+ Sony+ Renesas+ NXP+ Infineon-off-take-diversified largest-foundry-market-share ~62%+2025+ ASML EUV-largest-customer+ EUV-High-NA-2026-2027 first+ TSMC 2024 Chairman-Mark Liu-retirement C.C. Wei-successor+ TSMC-Arizona-Fab 21 union-tension-2024-2025+ TSMC-Kumamoto JASM-Sony-Denso-Toyota+ TSMC-Dresden ESMC-Bosch-Infineon-NXP-2024+ TSMC-Chandler+Anti-China-CFIUS+Export Controls October-2022+October-2023+December-2024 discipline, Intel Foundry Services IFS 2021-Pat Gelsinger-2024-departure-Lip-Bu Tan-2025-CEO Intel Foundry-restructuring+ Intel 4+Intel 3+Intel 20A-2024-scrapped+Intel 18A-Panther Lake-2025+Clearwater Forest-Xeon-2026+ Intel Ohio-New Albany-2022-groundbreaking-2027-2030-delay+ Intel Arizona-Fab 52+62-Chandler-Ocotillo 2024-production+ Intel Magdeburg-Germany-2024-paused-cost-cutting cautionary+ Intel Wroclaw-Poland-2024-paused cautionary+ Intel Kiryat Gat-Israel Fab 38-Kiryat Gat delay-2024+ Intel Kulim-Malaysia-advanced-packaging 2024+ Intel Foundry Ecosystem Alliance IFEA 2024+ Intel-Arm-2024-partnership 18A+ Intel-Microsoft-2024-1.8-2024+ Intel-DARPA 2024 RAMP-C 18A+ Intel-Amazon AWS 2024 custom 18A+ Intel-Israel-cash-refund-$3.5B 2024+ Intel-CHIPS Act direct $7.86B November 2024 final-award largest-recipient+ Intel-Apollo-Ireland Fab 34 Leixlip €11B-2022+ Intel-Brookfield-Arizona 2023 $30B joint-JV, Samsung Foundry Samsung Electronics Device Solutions Hwaseong+Pyeongtaek+Giheung+Onyang+Cheonan+Austin Fab-Austin-45nm+65nm+130nm+Taylor Texas 2022-groundbreaking-2024-2026-2028-delay+Samsung 3nm GAA-World-First 2022-Snapdragon 8 Gen 4+Exynos 2500+ 2nm SF2-2025+ 1.4nm SF1.4-2027+ Samsung Fab-16-Taylor Sussex TX-2028-2029-delay+ Samsung Foundry Ecosystem SAFE+ Samsung Foundry-Nvidia HBM3E-2024-2025-qualification-delay cautionary+ Samsung Foundry-Apple lost-2022-2024+ Samsung Foundry-Qualcomm-Snapdragon 8 Gen 3-lost-TSMC+ Samsung Foundry-AMD-lost+ Samsung Foundry-Google Tensor G5-2025 TSMC-switch cautionary+ Samsung HBM3+HBM3E-Nvidia qualification-delay-2024-2025+ Samsung Foundry restructuring 2024-2025+ Samsung Foundry yield-issues-3nm+2nm+ Samsung-Han Jin-man 2024 Foundry CEO+ Samsung Advanced Packaging-Austin+Cheonan+ Samsung 2.5D-I-Cube+H-Cube+X-Cube+ Samsung 3D-Stacked, GlobalFoundries $GFS Malta NY Fab-8+Dresden Fab-1+Singapore Fab-7+ GF 12+14+22+28+40+45+65+90+130+180+250nm+ GF FDX 22FDX+12FDX+ FinFET-abandoned 2018-7nm cautionary+ GF-IBM-Fishkill-2015+ GF-Chartered-Singapore 2010+ GF-Sony-Nagasaki+ GF Mode 10 IPO 2021-Mubadala-largest-shareholder+ GF-CHIPS Act $1.5B November 2024+ GF-DoD SHIP-Trusted Foundry-Silicon Photonics+ GF-Chandler-Arizona-2024 upgrade+ GF-Malta NY-2024 CHIPS Act expansion+ GF-Dresden-EU Chips Act 2024, United Microelectronics Corporation UMC $UMC Hsinchu+Tainan Fab 12A+ 6+12+14+16+22+28+40+55+65+90+110+130+150+180+250+350nm+ UMC-Fujitsu Mie 2023-2024-Fab-JV+ UMC-Intel-2024-N12i-Sunnyvale-partnership+ UMC-Powerchip Kaohsiung Fab-P3+ UMC-JV-Chinese TowerJazz 2019, Semiconductor Manufacturing International Corporation SMIC $981.HK Shanghai+Beijing+Tianjin+Shenzhen+ SMIC N+1+N+2-7nm-Huawei-Kirin 9000S-2023+Kirin 9010+Ascend 910B-DUV multi-patterning breakthrough+ SMIC-Big Fund II+III 2024-$45B+ SMIC-Entity List December 2020+ US Export Controls-October 2022+October 2023+December 2024 EAR-EAR-Foreign Direct Product Rule FDPR-Advanced Computing IC IFR discipline cautionary+ SMIC-BIS Direct Product Rule anti-Huawei Ascend cautionary+ SMIC Beijing-Beijing-Municipal-Government-JV Fab-9+SMIC South-Fab-13-Lingang Shanghai+SMIC-Xinsheng 2023, Hua Hong Semiconductor $1347.HK Shanghai+Wuxi Fab-1+3+5+7+ 90+130+150+180+250nm mature-analog-BCD-eNVM-largest-China-focus+ Hua Hong-Big Fund II+III 2024, Vanguard International Semiconductor VIS Hsinchu 8-inch-analog-power+ VIS-NXP-2024-Singapore Fab-JV 12-inch $7.8B+ VIS-Fab-2-Hsinchu, Powerchip Semiconductor Manufacturing Corporation PSMC-SBI Rapidus-Japan-technology-transfer 2024+ PSMC-Kaohsiung Fab-P3 12-inch $10.4B 2024, Tower Semiconductor $TSEM Migdal Haemek Israel+Nishiwaki Japan Newport+Arai+ Tower-Intel $5.4B 2022-2024 SAMR-China-blocked-August 2023 cautionary+ Tower-Intel Newport-2024 New Mexico partnership+ Tower-8-inch+12-inch analog+RF+silicon-photonics+MEMS+CIS+, Rapidus Corp Chitose Hokkaido Japan Toyota+Denso+Sony+NEC+NTT+SoftBank+Kioxia+Mitsubishi UFJ+MUFG 2022-founding+ Rapidus-IBM 2nm-2027-mass-production-target+ Rapidus-Chitose Hokkaido Groundbreaking September 2023+ Rapidus-EU EUV ASML 2024 first-Japan-High-NA-EUV+ Rapidus-Japan-METI-¥920B 2024+ Rapidus-Fugaku-2025 pilot+ Rapidus-Broadcom+Tenstorrent+Cadence 2024-partnership+ Rapidus IPO-2027-target cautionary, Kioxia Holdings-Kioxia $285A.T Yokkaichi Fab-Yokkaichi+Kitakami Fab-Iwate 2023-Yokkaichi-Fab-Y7+ Kioxia-Western Digital-SanDisk-2025-February-split-independent-companies-abandoned merger cautionary+ Kioxia-BiCS Flash 218-layer+ Kioxia IPO-2024-December-Tokyo-Bain Capital-exit largest 2024 Japan IPO+ Kioxia-Bain Capital-2018-Toshiba Memory carve-out+ Kioxia-Micron-Samsung-SK hynix NAND-oversupply-2023-2024 cautionary, Micron Technology $MU Boise ID+ Micron Fab 25 Boise 2028 US CHIPS Act largest+ Micron Clay NY Fab $50B 2025-2028+ Micron Xi'an Fab-China 2024+ Micron Taiwan Fab-16 Taichung+ Micron Manassas VA+ Micron Sanand India assembly 2024+ Micron HBM3E-Nvidia 8-Hi+12-Hi 2024-2025-qualified largest-share-gain+ Micron 232-Layer NAND+ Micron 1γ DRAM+ Micron 1β DRAM+ Micron CHIPS Act $6.14B November 2024, SK hynix $000660.KS Icheon+Cheongju+Wuxi Fab-M14+M15+M16+ SK hynix HBM3+HBM3E-Nvidia 8-Hi 2023-first+12-Hi 2024-first largest HBM-market-share ~50%+2025+ SK hynix M15X Cheongju $14.6B 2024+ SK hynix Yongin Cluster-largest-DRAM-world $91B 2027-2046+ SK hynix Indiana West Lafayette-advanced packaging $3.87B 2024-2028+ SK hynix Purdue partnership+ SK hynix-Kioxia-Bain Consortium 2018+ SK hynix-Solidigm Intel NAND 2020 $9B, YMTC Yangtze Memory Technologies Wuhan+ YMTC 232-Layer Xtacking 3.0+ YMTC-Big Fund I+II 2024-$45B+ YMTC-Entity List December 2022+ US Export Controls-October 2022+October 2023+December 2024 discipline cautionary+ YMTC-Apple lost 2022+ YMTC-Xiaomi+Vivo+Oppo+Honor Chinese-only-focus 2024, ChangXin Memory Technologies CXMT Hefei+ CXMT DDR4+DDR5+LPDDR4X+LPDDR5+HBM2E-2024-2025 pilot+ CXMT-Big Fund II+III 2024, Nanya Technology $2408.TWO Taiwan+ Nanya-Micron 1α+1β+1γ+ Nanya-Fab 3B, Winbond $2344.TW Kaohsiung Taiwan Serial-Flash+DRAM+HBM2E, Macronix $2337.TW Hsinchu+ Macronix-Nintendo Switch+Nokia, Nexchip Semiconductor Hefei+ Nexchip-Big Fund II+III 2024. AI-foundry+design-services startups (fabless-AI+chiplet+RISC-V): Tenstorrent Toronto $700M Series-C Samsung+LG+Fidelity+Baillie Gifford+XTX Markets+Bezos Expeditions+Hyundai+Rapidus-Wormhole+Blackhole+Grayskull+Wormhole+Ascalon RISC-V-Rapidus-2nm-2027+ Tenstorrent-Samsung Foundry-4nm+ Tenstorrent-Broadcom-2024 ASIC-partnership+ Jim Keller-CEO-2023, Cerebras Systems Sunnyvale $720M+ Series-G IPO-2024-2025-postponed-CFIUS-G42-review cautionary+ Foundation Capital+Benchmark+Coatue+Altimeter+VY Capital+Eclipse+G42 UAE+Andromeda+Condor Galaxy+ Cerebras WSE-3 4-trillion-transistor TSMC 5nm+ Cerebras Inference-2024 fastest-world+ Cerebras-Meta Llama 4-2025 partnership, Groq Mountain View $640M Series-D+ BlackRock+Neuberger Berman+Cisco+KDDI+Samsung Catalyst+D1+Tiger+Type One+ Groq LPU Language Processing Unit 14nm-Samsung-GlobalFoundries+ Groq-Aramco Digital 2024 largest-inference-cluster-Saudi Arabia+ Groq-KDDI-Japan-2024+ Groq-Bell Canada 2024, SambaNova Systems Palo Alto $1.1B+ SoftBank+Intel Capital+Google Ventures+Walden+Redline+BlackRock+Temasek+ SambaNova SN40L 5nm-TSMC+ SambaNova Cloud+ SambaNova-Argonne+SoftBank Japan Fugaku-Next 2025, Groq+Cerebras+SambaNova+d-Matrix+Rain AI+Etched+Positron+Untether AI-2024-shutdown cautionary+ Graphcore Bristol-SoftBank 2024-July-$500M reset cautionary+ Rebellions Seoul-KT+Sapeon Korea-2024 merger+ Furiosa AI Seoul Meta-acquisition-attempt 2025+ Ampere Computing SoftBank-2024-SoftBank-full-ownership pending+ Astera Labs $ALAB IPO-2024-March+ Marvell $MRVL Custom AI-Amazon+Microsoft+Google+ Broadcom $AVGO Custom AI-Google TPU+Meta MTIA+OpenAI-2026+ MediaTek $2454.TW-Nvidia GB10-2025 partnership+ AMD $AMD MI300+MI325+MI355+ Nvidia $NVDA Blackwell B200+GB200+ Nvidia CUDA+cuDNN+TensorRT+NIM. Advanced-packaging + CoWoS + HBM + hybrid-bonding + 2.5D + 3D + fan-out + panel-level (TSMC CoWoS-S+L+R+SoIC+InFO_oS+InFO_PoP+ CoWoS-Longtan+Miaoli+Chunan+Tainan-2025-2027 capacity-tripling largest-Nvidia+AMD+Broadcom-Google TPU-customer+ ASE Advanced Semiconductor Engineering $ASX Kaohsiung Taiwan largest-OSAT 2.5D+3D+FOWLP+VIPack+SiP+ ASE-Siliconware Precision SPIL 2018 $1.75B+ ASE-USI-Universal Scientific Industrial+ ASE-Malaysia Penang+ ASE-Chungli+ ASE-Vietnam-Nghe An 2024-2028 advanced-packaging $1B+ ASE-Intel 18A-2024-packaging-partnership+ ASE-AMD MI300+MI325+MI355-partnership, Amkor Technology $AMKR Tempe Arizona-Peoria new-fab 2024-2028 $2B TSMC-Peoria-anchor+CHIPS Act-2024 $400M+ Amkor-Apple-Peoria+ Amkor-Nvidia+ Amkor-J-Devices Japan+ Amkor-K3-K5 Incheon+ Amkor-Portugal Vila do Conde+ Amkor-Malaysia Penang+ Amkor-Philippines Muntinlupa+Laguna+ Amkor-Shanghai+ Amkor-Suzhou+ Amkor-Chandler Arizona, Powertech Technology $PTI Hsinchu+ Powertech-Xperi DBI Ultra hybrid-bonding+ Powertech-Micron+SK hynix HBM+ Powertech-Google Tensor+Meta MTIA, JCET Group Jiangsu Changjiang Electronics Technology $600584.SS Jiangyin China+ JCET-STATS ChipPAC Singapore-Korea 2015 $1.78B largest-China-OSAT+ JCET-Big Fund II+III 2024+ JCET-Samsung Suzhou 2016+ JCET-Huawei HiSilicon+SMIC-partnership+ JCET-USA Silicon Valley+Korea+Japan-office, TongFu Microelectronics Suzhou+ TongFu-AMD Suzhou+Penang 85% AMD-back-end-outsourced+ TongFu-Big Fund II+III+ TongFu-Guangdong Zhaoqing+ TongFu-Xiamen+ Tianshui Huatian Technology Gansu+ Huatian-Kunshan+Xi'an+ Huatian-Nantong-Fujitsu-2019, ChipMOS Technologies $8150.TW+$IMOS+ ChipMOS-Japan Hsinchu+Tainan+ ChipMOS-DDIC largest-worldwide+ ChipMOS-Samsung Display+LG Display+BOE+CSOT, Chipbond Technology $6147.TWO Miaoli+ Chipbond-DDIC-2nd worldwide+ Chipbond-Novatek+Himax+Sitronix, King Yuan Electronics $2449.TW+Ardentec Miaoli test+ Sigurd Microelectronics+ Formosa Advanced Technologies+ Global Testing+ Ardentec Malaysia Kulim+ Ardentec Chungli, Nepes Corporation South Korea+ Nepes-Ncepack Cheongju 2019 fan-out-panel-level FOPLP world-first-mass-production+ Nepes-Yongin-2024 CoWoS-equivalent-competitor+ Nepes-Applied Materials+SK hynix, Adeia $ADEA Xperi DBI Ultra hybrid-bonding IP-licensing+ Adeia-Micron+SK hynix+Kioxia+Samsung+TSMC-license 2024-2025+ Adeia-Intel Foundry 2024+ Adeia-YMTC-license 2024. Startup-advanced-packaging: Applied Materials Ventures+ ASE Ventures+ TSMC-Global Unichip GUC $3443.TW-TSMC-controlled-ASIC-service+ Faraday $3035.TW UMC-controlled+ Alchip $3661.TW-AWS Graviton+Trainium+Google TPU+MediaTek-partnership. WFE Wafer Fab Equipment + Lithography + Etch + Deposition + Metrology (ASML $ASML Veldhoven Netherlands EUV+High-NA-EUV+DUV+ ASML NXE:3600D+3800D+3800E 220 wafers-per-hour EUV+ ASML NXE:5000-High-NA-EUV first-Intel-2024+ TSMC-2025+Samsung-2025+Rapidus-2027 first-High-NA+ ASML EUV-Zeiss SMT-Oberkochen supplier+ ASML DUV-KrF+ArF-immersion+ ASML NXT:2100i+NXT:2050i+ ASML NXT:870+ ASML China-restrictions-October 2023 Netherlands-export-license Twinscan NXT:2000i+NXT:2050i+NXT:2100i cutoff cautionary+ ASML EAR-CFIUS-cautionary+ ASML-Berlin+ ASML-San Diego Cymer light source+ ASML-Wilton Connecticut+ ASML-Linkou+ ASML-Chandler Arizona+ ASML High-NA revenue-2025+ ASML 2025 Q3-slowdown-China-restrictions cautionary, Applied Materials $AMAT Santa Clara CA largest-WFE-vendor $27B revenue-2024+ AMAT Endura+Producer+Centris+Sym3+Selectra+Applied Materials Center of Excellence for Materials Innovation-2024 Silicon Valley $4B+ AMAT-Reflexion+ AMAT-Vistara+ AMAT-Charger 2024 selective-tungsten-deposition+ AMAT PROVision+SEMVision+VeritySEM eBeam metrology+ AMAT ICAPS Center-Bangalore 2024+ AMAT China Export-Controls-October 2023+December 2024 cautionary+ AMAT-Kokusai-Applied 2020 blocked-China cautionary+ AMAT-SEMI Vision-CFIUS discipline, Lam Research $LRCX Fremont CA+ Lam Kiyo+Sense.i+Coronus+Coronus DX+Coronus Duo+Coronus 4E+Vector Extreme+Vector G+Vector V+Vector Y+ Lam Ionic Deep Silicon Etch+ Lam Cryo Etch 3.0 high-aspect-ratio-NAND HBM through-silicon-via TSV+ Lam-Silfex Springfield OH+ Lam Malaysia Batu Kawan-2024 largest-outside-US 24/7+ Lam-Sematech-consortium+ Lam-Novellus 2011 $3.3B+ Lam-KLA-blocked 2019 cautionary+ Lam China Export-Controls-October 2023+December 2024 cautionary, KLA Corporation $KLAC Milpitas CA process-control+metrology largest-market-share+ KLA 39x1+SP1x+SP2x+SP3x+SP5x+Puma 9000+9500+9800+CIRCL+eDR+eSL+Voyager+Kronos+Talus+ KLA-Tencor 1997+ KLA-Orbotech 2019 $3.4B+ KLA-Anchor Semiconductor+ KLA-Rudolph 2019+ KLA-Onto Innovation 2019 cross-competitor+ KLA China Export-Controls-October 2023+December 2024 cautionary, Tokyo Electron TEL $8035.T Tokyo largest-Japan-WFE+ TEL Coater-Developer track-largest-EUV+ TEL Etch+CVD+ALD+wafer-clean+wafer-prober+wafer-inspection+ TEL-Applied 2013 blocked-antitrust cautionary+ TEL-Kokusai+ TEL-Zeus+ TEL Miyagi+Yamanashi+Tohoku+Hokkaido+Kumamoto+Tainan+Chandler+ TEL-Rapidus-Chitose partnership 2024+ TEL China Export-Controls-2023+2024 cautionary, Onto Innovation $ONTO Wilmington MA+Bloomington MN+ Onto-Rudolph+Nanometrics 2019+ Onto Aspect+Impulse+Truebore+Wafer-Sight+ Onto-Micron+Samsung+SK hynix+ Onto-Nano-Photonic-2024 HBM+CoWoS+, Lasertec $6920.T Yokohama-largest-EUV-mask-inspection world+ Lasertec MATRICS X+ACTIS+ELS-Blank+ Lasertec-only-EUV-actinic-mask-inspection-supplier-monopoly+ Lasertec-2024-Q4-CFIUS-Rapidus-Samsung-Intel Foundry-order-surge, Screen Holdings $7735.T Kyoto wafer-clean+track largest-competitor-TEL+ Screen-Advanced Track+ Screen-SUC-Wet+Cryogenic+ Screen-Sokudo+ Screen-Chandler Arizona-2024 expansion+ Screen China Export-Controls cautionary, ASM International $ASM Almere Netherlands+ASMI ALD-largest-market-share+ ASMI Intrepid+Polygon+Pulsar+ ASMI-ASM Pacific-Hong Kong+ ASMI-Wuxi 2024 expansion+ ASMI-Chandler Arizona+ ASMI-Dresden ESMC 2024 ETES+, Kokusai Electric-KE Holdings Yokohama+ KE Vertical-Batch+Single-Wafer+ KE-Applied Materials 2020 blocked cautionary+ KE IPO 2023+ KE-Rapidus-Chitose 2024+ KE-Micron+Samsung+SK hynix+SMIC+YMTC+CXMT-installed, Nikon $7731.T Yokohama DUV-ArF-Immersion 2nd-place-ASML+ Nikon NSR-S635E+ Nikon-2024 revenue reset cautionary Canon $7751.T Tokyo DUV+i-Line+g-Line+ Canon FPA-8000+ Canon NIL Nanoimprint Lithography FPA-1200NZ2C 2024-Kioxia-first-mass-production-3D NAND-alternative-to-EUV cautionary, Advantest $6857.T Tokyo largest ATE Automated Test Equipment+ Advantest V93000+T2000+HA5100+ Advantest-Nvidia-AMD-Broadcom-MediaTek-largest-customer+ Advantest-Kaohsiung-Chandler Arizona 2024 expansion+ Advantest revenue-2024-record HBM+CoWoS-testing, Teradyne $TER North Reading MA ATE 2nd-largest+ Teradyne UltraFLEX+FLEX+J750+Magnum V+ Teradyne-Universal Robots 2015 collaborative-robotics+ Teradyne-Nvidia-Qualcomm-MediaTek-customer, Cohu $COHU Poway CA test-handler+ Cohu-Xcerra 2018+ Cohu Diamondx+Delta+DI-Core+ Cohu-CATS+Cohu-Contactor, Camtek $CAMT Migdal Haemek Israel-CoWoS-HBM inspection-2024 revenue-doubling largest gain, Ichor Systems $ICHR Fremont CA WFE-subsystem+ Ichor-IMG-Icon 2018+ Ichor-liquid-delivery-system+ Ichor-Chandler+ Ichor-Malaysia, Ultra Clean Holdings $UCTT Hayward CA WFE-subsystem+ Ultra Clean-Ham-Let 2018+ Ultra Clean-Cinos Korea 2021, Entegris $ENTG Billerica MA specialty-materials+FOUP+wafer-carrier+CMP-pad+filter+ Entegris-CMC Materials 2022 $6.5B+ Entegris-Chandler Arizona+Kaohsiung Taiwan+ Entegris-CHIPS Act 2024 $200M+ Entegris-Pall Corporation, MKS Instruments $MKSI Andover MA vacuum+laser+ MKS-Atotech 2022 $6.5B+ MKS-Ophir+MKS-Newport+MKS-Photon Control+MKS-ESI Excimer+ MKS-Delphi Circuits+ MKS-2024 Ransomware Feb-2023 cautionary, Edwards Vacuum-Atlas Copco Sweden $ATCO-B.ST vacuum-pump+abatement+ Edwards-BOC 2007+ Edwards-Atlas Copco 2014, Kurita Water Industries+Ovivo+Veolia-Suez+Nomura Micro Science+Organo+ Kurita-Fresh Meadow Power ultra-pure-water. AI-WFE startup: PDF Solutions $PDFS+ Onto+ Nova $NVMI Israel-metrology+ Nova-ReVera 2015+ Nova-Ancosys+ Nova-Sentronics 2024 CoWoS+HBM+ Onto-Rudolph+Nanometrics+ Bruker $BRKR-AFM+ Rudolph-Onto 2019+ Nordson $NDSN+ Cohu $COHU+ Aehr Test $AEHR+ Photon Dynamics-KLA+ FormFactor $FORM MEMS-probe-card+ FormFactor-Advanced Micro Devices AMD-2024+ FormFactor-Micro-Probe 2016, imec Leuven Belgium largest-R&D-Consortium-world+ imec-ASML+AMAT+Lam+KLA+TEL+Onto+Screen+ASMI+Kokusai+ imec-High-NA EUV pilot+ imec-Belgian-Federal-Government-Flanders €3B 2024+ imec-Chip 2024 US-$120M+ imec-Chandler Arizona 2024, Sematech-defunct 2015 Austin-precedent+ Fraunhofer IPMS Dresden ESMC+ CEA-Leti Grenoble+ ITRI Industrial Technology Research Institute Hsinchu+ HHNCM Hong Kong-InVec+ ETRI+KAIST+SNU+POSTECH+ IIT+ TSMC-Cornell+MIT+Stanford+Berkeley+Caltech+ UMich+UT Austin+Georgia Tech+Purdue+Notre Dame+RPI, and (d) materials + photoresist + CMP + specialty-gas + wafer + mask + electronics-chemicals (JSR Bain Capital 2023 $6.2B take-private+ JSR-Inpria EUV metal-oxide resist 2021+ JSR-Rapidus-2024 partnership+ JSR EUV+ArF-Immersion+KrF resist largest-world+ JSR-Sumitomo Chemical+Shin-Etsu Chemical+Tokyo Ohka Kogyo TOK+FujiFilm-Sunnyvale Semiconductor Materials competition, Tokyo Ohka Kogyo TOK $4186.T largest-EUV-photoresist post-JSR+ TOK-EUV multi-supplier-strategy-Rapidus Sumitomo Chemical+Shin-Etsu Chemical, Shin-Etsu Chemical $4063.T largest-silicon-wafer world 300mm+ Shin-Etsu-Photo Resist+PVC+ silicon-wafer duopoly+ Shin-Etsu SUMCO $3436.T-2nd 300mm-wafer world+ SUMCO-Kokusai Electric-parent+ SUMCO-Chandler Arizona 2024 expansion, GlobalWafers $6488.TWO Taiwan-Doral Michigan Sherman TX Fab 2024-2028 $5B largest-US-silicon-wafer+ GlobalWafers-CHIPS Act 2024 $406M+ GlobalWafers-Siltronic-2022-German-blocked-cautionary, Wacker Chemie Siltronic $WAF.DE Burghausen 300mm-wafer+ Siltronic-GlobalWafers 2022 cancelled cautionary, Soitec $SOI.PA France Silicon-On-Insulator SOI+ Soitec-Bernin+Singapore+ Soitec-Smart-Cut+FD-SOI+RF-SOI+POI Piezo-On-Insulator, Fujimi Incorporated Japan CMP-slurry+ CMC Materials-Entegris 2022+ Cabot Microelectronics-2020 CMC+ Versum Materials-Merck KGaA 2019 $6.5B+ Merck KGaA Electronics-EMD Electronics+ Merck-Versum-Intermolecular 2020+ Air Products $APD specialty-gas Onsite Fluor+ Linde $LIN plc Guildford UK+Air Liquide $AI.PA Paris+ Taiyo Nippon Sanso Nippon Sanso Holdings $4091.T+ Iwatani Corporation Japan+ Kanto Denka Kogyo Japan+ Central Glass Japan+ SK Materials Korea+ Praxair Linde-2018+ NuSil-Silica Silicones+ 3M-SEMI GARD 2024+ 3M-Novec forever-chemical PFAS EPA 2024-phase-out cautionary+ Chemours+ DuPont-Chemours 2015+ DuPont Electronics EIT+ DuPont-Rohm and Haas 2009+ Corning $GLW glass-carrier+precision-glass+ HOYA $7741.T EUV+ArF-mask-blank largest+ AGC $5201.T mask-blank+silica+, Photronics $PLAB Brookfield CT largest-independent-photomask+ Photronics-Toppan+DNP 2024 partnership+ Photronics-Xiamen+Suzhou-Big Fund II+III 2024 pressure+ Toppan Photomask $7911.T+ Dai Nippon Printing DNP $7912.T+ SK-Enpulse+ IBM-Photomask 1997 cautionary. Regulatory+funding+CHIPS+Big Fund+EU Chips Act discipline: US CHIPS and Science Act August 2022 $52.7B $39B manufacturing+ $13B R&D+workforce+ DOC Department of Commerce CHIPS Program Office CPO 2022-2024 awards+ Intel $7.86B November 2024 final-largest+ TSMC $6.6B November 2024+ Samsung $4.75B December 2024+ Micron $6.14B November 2024+ SK hynix $458M+ GlobalFoundries $1.5B November 2024+ Wolfspeed $750M+ BAE Systems $35M+ Microchip $162M+ Absolics $75M+ HP Enterprise DoE Frontier+ Amkor $400M+ SkyWater $16M+ Rocket Lab Neutron $23M+ Coherent $33M+ Applied Materials $4B R&D+ Lam Research+ KLA+ Entegris $200M+ GlobalWafers $406M+ ASML NC+ National Semiconductor Technology Center NSTC 2024 NSF Berkeley+Sunnyvale+Albany+ National Advanced Packaging Manufacturing Program NAPMP 2024 $1.6B+ CHIPS-R&D 25% ITC Investment Tax Credit-2024+ DoD Microelectronics Commons 2023-2024 Hub-8 $2B+ DARPA ERI Electronic Resurgence Initiative 2017-2027+ DARPA-Rapidus-Broadcom-Cadence+ DoE Frontier+El Capitan+Aurora+ CFIUS Committee on Foreign Investment US+ Bureau of Industry and Security BIS Entity List October 2019+2020+ US Export Controls-October 7 2022+October 17 2023+December 2 2024 Advanced Computing IC+HBM+ETO+Foreign Direct Product Rule FDPR-Huawei-SMIC-YMTC cautionary+ SEMI-lobby+ Chip 4 Alliance US+Taiwan+Japan+Korea 2022-informal+ FABS Act 2024-pending 25%-refundable-ITC. EU Chips Act 2023 €43B+ EU Sovereign Semiconductor 2022-2030 20%-world-market-target+ ESMC Dresden 2024+ Intel Magdeburg-paused cautionary+ Wroclaw-paused+ Kiryat Gat+ EU IPCEI Micro 2018+2023-second-wave+ EU Horizon Europe €95.5B 2021-2027+ EU KDT-Chips JU Key Digital Technologies+ EU EIT Digital+ EU Battery Regulation-2023 EU AI Act-2024+ EU CBAM+ EU CSRD+ EU CRA Cyber Resilience Act+ EU NIS-2+ EU Design 6.0+ imec Belgium €3B 2024. Japan METI ¥3.4T 2022-2024+ Rapidus-Chitose ¥920B+ TSMC JASM Kumamoto ¥1.2T Fab-1+ Kioxia-Western Digital NAND ¥300B 2024+ Micron Hiroshima ¥465B 2024+ Samsung Yokohama R&D 2024+ Japan Semiconductor Strategy 2021+2023-revised+ Japan-US Semiconductor Alliance 2022-Kishida-Biden+ Japan-Netherlands-2023 Export Controls alignment. Korea K-Chips Act 2023+ SK hynix Yongin $91B+ Samsung Pyeongtaek+Taylor+ Korea National Strategic Technology 15% ITC+ Korea Semiconductor Ecosystem 2024. Taiwan TSMC Advanced-Chip Special-Zone Chunan+Baoshan+Longtan Kaohsiung+Taichung+ Taiwan Chip-based Industrial Innovation Program 2023-2033 NT$3B+ ITRI+ Ministry of Digital Affairs+ MOEA Ministry of Economic Affairs. China Big Fund-China Integrated Circuit Industry Investment Fund I 2014-¥138.7B+II 2019-¥204.1B+III May 2024-¥344B $47.5B largest+ Big Fund-SMIC-Hua Hong-YMTC-CXMT-Nexchip-JCET-TongFu-Naura-AMEC-ACMR-Piotech-Zhongwei-Kingsemi-largest recipients+ Made in China 2025+ 14th Five-Year Plan+ China SAMR-Antitrust review Tower-Intel-blocked-August 2023 cautionary+ China Cyberspace Administration CAC Micron-China-2023 ban cautionary+ China Anti-Dumping Duty-Micron-2024. India Semicon India Programme $10B 2021+ Modified Scheme Semiconductor+Display Fab Ecosystem 2024+ Tata Electronics Assam+Dholera Gujarat+Sanand Gujarat+ Micron Sanand assembly 2024+ CG Power-Renesas-Stars Microelectronics-Sanand+ Kaynes Semicon Sanand+ Vedanta-Foxconn-Dholera-2023 cancelled cautionary+ ISM India Semiconductor Mission+ IESA+ SEMI India+ Karnataka+Gujarat+Maharashtra+Uttar Pradesh+Odisha state-incentives 2024 — all-against Intel Magdeburg-paused 2024+ Wroclaw-paused 2024+ Kiryat Gat-delay 2024+ Ohio New Albany-delay 2024-2027-2030+ 20A-scrapped+ Vedanta-Foxconn Dholera-2023 cancelled+ GF-7nm-abandoned 2018+ Samsung Taylor Fab 2-delay 2024-2028+ Rapidus-2027 target execution-risk+ Whim MaaS 2024 Ch-11+ Ampere SoftBank-2024+ Ampere SoftBank 2024-full+ Furiosa-Meta 2025+ Graphcore-SoftBank $500M reset+ Untether AI-2024 shutdown+ Tower-Intel-SAMR blocked August 2023+ Applied-Kokusai 2020 blocked+ KLA-Lam 2019 blocked+ TEL-Applied 2013 blocked+ Siltronic-GlobalWafers 2022 EU-blocked+ US Export Controls October-2022+2023+December 2024 EAR+FDPR+Advanced Computing IC+HBM+ETO+SMIC+YMTC+CXMT+Huawei-Ascend-Kirin cautionary+ CFIUS-Cerebras-G42+ CFIUS-Newport Wafer Fab Nexperia UK-2022 forced-divestment+ Netherlands-ASML NXT:2000i+2050i+2100i cutoff January 2024+ Japan-METI 23-Types Semiconductor Equipment July 2023 Export Controls+ Korea-Chips 4-informal+ TSMC-Chinese-mainland-100%-blocked+ Samsung-Xi'an+SK hynix-Wuxi VEU Validated End User-conditional cautionary called out.
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