Envoy Technologies Funding: $83M Raised, Series A (2021)
Envoy Technologies is based in Culver City, California. It has raised $83M in total funding. Latest round: Series A.
Envoy Technologies funding overview
Envoy Technologies is based in Culver City, California. Envoy Technologies has raised $83M in total disclosed funding. That places its disclosed total in the $25M–$100M range. Its most recent disclosed round is a Series A announced in January 2021. The round record for Envoy Technologies runs through 2021; nothing later has been disclosed. Investors on record include Shell Ventures, Building Ventures, DENSO, Goodyear Ventures, GroundBreak Ventures, Los Angeles Cleantech Incubator Impact Fund and 1 others. 7 distinct backers are named across the disclosed rounds.
Envoy Technologies at a glance
Total raised
$83M
Latest round
Series A
Latest round date
January 2021
Headquarters
Culver City, California
Notable investors
Shell Ventures, Building Ventures, DENSO, Goodyear Ventures, GroundBreak Ventures, Los Angeles Cleantech Incubator Impact Fund, Macquarie Asset Management
Frequently asked about Envoy Technologies funding
How much has Envoy Technologies raised?
Envoy Technologies has raised $83M in total disclosed funding across the rounds on record.
Who has invested in Envoy Technologies?
Shell Ventures, Building Ventures, DENSO, Goodyear Ventures, GroundBreak Ventures, Los Angeles Cleantech Incubator Impact Fund are named among the investors backing Envoy Technologies.
What was the latest Envoy Technologies funding round?
The most recent disclosed round is a Series A, announced in January 2021.
Where is Envoy Technologies based?
Envoy Technologies is based in Culver City, California.
When did Envoy Technologies last raise?
The last disclosed Envoy Technologies round closed in January 2021 at Series A.
We update the Envoy Technologies record whenever a new round is filed or announced, so the totals above track the public record rather than estimates. Related companies in Culver City and their backers are listed below.
